We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Forming Technology.
ipros is IPROS GMS ・ IPROS One of the largest technical database sites in Japan that collects information on.

Forming Technology Product List and Ranking from 12 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

Forming Technology Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

  1. 林テレンプ Aichi//Industrial Electrical Equipment
  2. プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所 Saitama//Electronic Components and Semiconductors
  3. 寺田 Tokyo//Electronic Components and Semiconductors
  4. 4 特殊阿部製版所 Tokyo//Other manufacturing
  5. 5 サトーセン Osaka//Electronic Components and Semiconductors
Go to Company Ranking

Forming Technology Product ranking

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

  1. Phase difference film formation technology for lens curved surfaces 林テレンプ
  2. Purikenn Co., Ltd. Printed Circuit Board Solder Resist Formation Technology プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所
  3. High-frequency device-compatible double-sided wiring process formation technology using transparent substrates. 寺田
  4. 4 Conductive pattern formation technology using pad printing method 特殊阿部製版所
  5. 4 Technical Introduction: "Sealing Resin Leakage Prevention, Dam Technology" サトーセン

Forming Technology Product List

1～14 item / All 14 items

Displayed results
High Aspect Ratio Via Formation Technology

High Aspect Ratio Via Formation Technology

High-aspect-ratio via formation technology using glass resin substrate materials

This is a technology for forming build-up vias used in the production of high-frequency antenna patterns on printed circuit boards. While laser processing is commonly used for build-up vias, high-precision via formation using mechanical drilling and the developed high-aspect-ratio plating layer have enabled the formation of vias with a drill diameter of 0.15 mm and an interlayer distance of 0.6 mm, achieving a high aspect ratio of 4. This has made flexible antenna design for high-frequency antenna patterns possible.

  • Circuit board design and manufacturing

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Drying and Particle Formation Technologies for the Global Chemical Industry

Drying and Particle Formation Technologies for the Global Chemical Industry

GEA Niro has the know-how to meet any request.

The drying technology and engineering expertise that produce high-quality powdered products play a significant role in the industry. GEA Niro understands the importance of such technologies better than anyone else. GEA Niro has data accumulated over more than 75 years of experience and a track record of approximately 10,000 installations. The characteristics required for powdered products are diverse. However, GEA Niro possesses the know-how to create the desired characteristics. Furthermore, they also have the expertise to design the processes necessary to manufacture such characteristic products and provide the plants and equipment needed. [Features] - Over 75 years of experience and more than 10,000 plant installations - Familiar with all technical solutions from lab tests to industrial-scale production For more details, please contact us or download the catalog.

  • others

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Carbon Nanotube Coating Formation Technology - Development Case (Anodic Oxidation)

Carbon Nanotube Coating Formation Technology - Development Case (Anodic Oxidation)

Developing carbon nanotube formation technology! We accept application development and technical partnerships for preventing screw galling and seizure, as well as for hydrophobic and hydrophilic metal surface treatments.

Our company offers anti-seizing technology for stainless steel bolts and nuts that can be used in various fields to meet market needs. In addition to anti-seizing (friction-reducing), we propose possibilities for various applications such as preventing frost on sliding parts and heat dissipation fins through the addition of various functions (increased hardness, water repellency, etc.). Unlike anti-seizing coatings, there is no risk of film detachment, making it suitable for use in food-related and semiconductor industries where dust control is necessary. We welcome partnerships for application and technology development, and we can provide samples. 【Features】 ■ Usable in food-related and semiconductor industries ■ Almost no dimensional changes to the target object ■ Can be used in the mating parts where seizing occurs during engagement ■ Low cost with a wet process suitable for mass production ■ Capable of adding various functions to various metal materials (stainless steel, iron, copper, etc.) *For more details, please refer to the PDF document or feel free to contact us.

  • Surface treatment contract service

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Bulk formation technology of 'fine resist patterns' for surface modification [University of Electro-Communications]

Bulk formation technology of 'fine resist patterns' for surface modification [University of Electro-Communications]

It is possible to form micro-patterns on diverse surface shapes in a wide range, at high speed, and at low cost.

In functionalization through surface modification, there is a technology that forms fine patterns on the surface of the workpiece using high-energy lasers or machining. While these methods have the advantage of being able to produce highly precise patterns, they face challenges such as the high cost of equipment and the difficulty of processing three-dimensional objects. This technology enables the formation of fine patterns on three-dimensional objects in a simple and cost-effective manner by applying the optical property of speckle to lithography. Features of the new technology: - Fine processing technology utilizing speckle light - Formation of fine dot-like random resist patterns on the surface of parts (approximately a few to several hundred micrometers) - Ability to form patterns collectively on the circumferential surface of cylindrical parts - Ability to form patterns collectively on the surfaces of parts with steps (step surfaces of several tens of millimeters) The resist patterns formed by this technology are expected to provide functionality to the surface of the workpiece. (Improvements in water repellency, hydrophilicity, dirt resistance, lubricity, anti-reflection, antibacterial properties, and biocompatibility, etc.)

  • Other surface treatment equipment

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Conductive pattern formation technology using pad printing method

Conductive pattern formation technology using pad printing method

The formation of conductive patterns on three-dimensional curved surfaces, which was previously difficult, has become possible using the pad printing method.

We would like to introduce our "Conductive Pattern Formation Technology using Pad Printing Method." The pad printing method is a type of gravure offset printing. A printing pattern is formed in a recessed shape through etching on a flat steel plate, creating a printing plate. After applying paste (ink) over the entire plate surface, the unnecessary paste (ink) in the non-image areas is scraped off with a doctor blade. The paste is then transferred to a flexible rubber, such as silicone, called a pad, which is used to transfer the pattern onto the substrate. Since the paste (ink) is transferred using a flexible pad, printing is possible not only on flat surfaces but also on three-dimensional shapes with unevenness and contours. [Features] - A printing pattern is formed in a recessed shape through etching on a flat steel plate, creating a printing plate. - Paste (ink) is transferred using a flexible pad. - Printing is possible on three-dimensional shapes with unevenness and contours, not just flat surfaces. *For more details, please refer to the PDF document or feel free to contact us.

  • Printing/Publishing

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Technical Introduction: "Sealing Resin Leakage Prevention, Dam Technology"

Technical Introduction: "Sealing Resin Leakage Prevention, Dam Technology"

Introducing technology to prevent resin leakage! It is possible to prevent resin from leaking.

At Sato-Sen Co., Ltd., we can permanently fill epoxy holes to prevent resin from leaking to the backside through the via during resin sealing. Additionally, if you want to perform solder suction through the via while preventing resin sealing leakage, it is possible to create a tent over the via using film solder resist or copper foil. 【Features】 - Completely prevents leakage of sealing resin for chip vias - Capable of forming a dam to block resin sealing after component mounting - Dam formation technology suitable for BGA and flip chip mounting Please contact us for more details.

  • Printed Circuit Board

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Technology for forming fine uneven structures on rubber surfaces

Technology for forming fine uneven structures on rubber surfaces

Introducing fine uneven structures on the rubber surface through gas treatment! The gas treatment uses chemical etching, ensuring excellent uniformity.

<Technology for Forming Fine Uneven Structures on Rubber Surfaces> 【Features】 ■ Applicable to almost all types of rubber (including silicone rubber, FKM, etc.) ■ Freedom in the shape of the processed items ■ Possible applications include increased surface area and improved adhesion The formation of fine structures leads to various enhancements such as improved lubricity and adhesion. The original mold can be used as is. No contamination occurs like with blast processing. Utilizing the high reactivity of fluorine gas, the rubber surface is chemically etched to form fine uneven structures! The original mold can be used as is. No contamination occurs like with blast processing. Since it is a vapor-phase treatment, it penetrates even the finest parts, allowing for uniform processing regardless of shape. Complex molded bodies, structures, and internal surfaces of cylinders (tube/hose inner surfaces) are also possible. Keywords Etching, Blast Processing, Sandblasting, Plasma Treatment

  • Other surface treatment equipment

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Tough coat

Tough coat

It forms a completely uniform coating without changing the surface accuracy of aluminum die-cast and cast materials.

"Tough Coat" is a technology that forms a tough and dense composite film by the polymerization of a special synthetic resin contained in the electrolyte solution along with an anodized coating. It is suitable for improving the airtightness of aluminum die castings with casting defects. Since it is a special anodized coating with airtightness, it does not peel off like plating or painting, and there are no occurrences of pinholes or cracks. The polymerization of the special synthetic resin provides excellent chemical resistance and corrosion resistance. 【Features】 ■ Forms a tough and dense composite film ■ Excellent lubricity, reducing the coefficient of friction and providing outstanding wear resistance ■ No occurrences of pinholes or cracks ■ Excellent chemical resistance and corrosion resistance due to the polymerization of the special synthetic resin ■ Suitable for improving the airtightness of aluminum die castings with casting defects *For more details, please refer to the PDF document or feel free to contact us.

  • others

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Purikenn Co., Ltd. Printed Circuit Board Solder Resist Formation Technology

Purikenn Co., Ltd. Printed Circuit Board Solder Resist Formation Technology

Microscopic openings and high-precision alignment! Formed by direct imaging method.

Smartphone chip components are becoming increasingly smaller, and product testing for 0201 sizes is actively being conducted. In printed circuit boards, the formation of micro-openings and the ability for high-precision alignment are becoming important. At Priken, we provide substrates that achieve both micro-openings and high positional accuracy by forming solder resist openings using direct imaging methods. Please feel free to contact us if you have any requests. 【Specifications】 ■ Minimum opening size: Φ70±5μm ■ Pattern/resist clearance: 20μm ■ Mask film-less *For more details, please download the PDF or feel free to contact us.

  • 図3.jpg
  • Printed Circuit Board

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Phase difference film formation technology for lens curved surfaces

Phase difference film formation technology for lens curved surfaces

We are developing "phase difference lenses" by applying a phase difference film to glass and resin with lens shapes, utilizing the characteristics of our proprietary materials.

We are developing "phase difference lenses" that utilize the characteristics of our unique materials by applying a phase difference film to glass and resin with lens shapes.

  • lens

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Circuit formation technology using printing methods by Kyoritsu Elex.

Circuit formation technology using printing methods by Kyoritsu Elex.

Please consult with a specialized manufacturer of high-performance ceramic substrates.

Technology for Forming Printed Circuits on Ceramic Substrates Our company offers a comprehensive in-house process for forming circuits aimed at electronic component applications on ceramic substrates manufactured internally, utilizing advanced printed circuit formation technology. By employing screen printing methods, we can provide custom solutions with shorter lead times compared to etching methods. Additionally, the printed materials undergo high-temperature baking (850°C), ensuring stable performance and high reliability. The printed materials are not limited to wiring materials (metal pastes) but also include insulating glass materials and ceramic materials, which can also be printed. Furthermore, we have achieved not only circuit formation but also the creation of "through vias" and "multilayer circuit structures." We are advancing technology development to meet various application possibilities, and we look forward to your inquiries.

  • Fine Ceramics
  • Printed Circuit Board

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
High-frequency device-compatible double-sided wiring process formation technology using transparent substrates.

High-frequency device-compatible double-sided wiring process formation technology using transparent substrates.

[In Development] This is a manufacturing method that reduces materials, processes, energy, and waste in conventional construction methods, contributing to environmental protection through decarbonization.

In our country, research and development is progressing towards the full-scale adoption of 5G, which realizes "ultra-high speed," "ultra-low latency," and "massive simultaneous connections." Compared to the current 4G, 5G requires approximately 100 times the communication capacity and needs to handle electrical signals in the high-frequency range; however, increasing frequency comes with the drawback of increased transmission loss. Currently used transmission substrates, such as polyimide resin, which are commonly employed, have low dielectric properties, and simply improving wiring technology cannot meet the low transmission loss required in the high-frequency range for 5G. Therefore, the use of materials with superior dielectric properties has become a challenge. This new technology will not only make antennas for 5G transparent but also enable the transparency of millimeter-wave radar antennas used for collision avoidance, which is essential for autonomous driving, significantly easing the restrictions on antenna installation locations.

  • High frequency/microwave parts
  • Printed Circuit Board
  • Other electronic parts

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
COPYRIGHT © 2001-2025 IPROS CORPORATION ALL RIGHTS RESERVED.